Turn-Key Electronics Manufacturing Services for PCB Assembly

Assembly reliability, also known as process reliability, usually refers to the PCBA fabrication is not destroyed by normal operation ability. If the improper design, it is

by:Rigao      2020-05-02
Assembly reliability, also known as process reliability, usually refers to the PCBA fabrication is not destroyed by normal operation ability. If the improper design, it is easy to make welding good solder joints or components damage or injury. BGA, chip capacitor, chip vibration stress sensitive device, easy for mechanical or thermal stress damage, therefore, when the design should be in the PCB layout is not easy deformation, or for reinforcement design, or use the appropriate measures to evade. ( 1) Stress sensitive components should wash cloth as far as possible away from the PCB assembly time easy to bent. Such as in order to eliminate the bending deformation of the sheet assembly time, should as far as possible to join the sub board with the motherboard connector cloth on the edge of the sheet, distance of screw distance not more than 10 mm. For example, in order to avoid the BGA solder joint stress fracture, should avoid the BGA layout easy bending takes place when PCB assembly. BGA bad design, on the one hand take plate is easy to cause the solder joint cracking. ( 2) For big size four corners of the BGA. PCB bending, the corners of BGA solder joint stress of the largest, the most prone to cracking or fracture. Therefore, the reinforcement of BGA corners is very effective to prevent cracking Angle welds, should use special glue to reinforce, patch glue can also be used for reinforcement. This requires components when layout room, note the reinforcement on the process documentation requirements and methods. The above two Suggestions, mainly from the design into consideration, on the other hand, should improve the assembly process, reducing the generation of stress, such as to avoid single hand board, install screw use support tooling. Therefore, the reliability of the assembly design should not only confined to the layout of the components improve, more should reduce the stress of the assembly - The use of appropriate methods and tools, strengthen personnel training, standardized operation action, only in this way can solve the problem of solder joint failure occurred the assembly stage.
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