However, in the process of manufacturing, even if the alternative components on the list and encapsulation is very slight deviation, also could lead to serious problems to the assembly process. For example, components because too close to be placed, online test point is too close, and even in the components below or use the wrong components. If effective assembly analysis beforehand, can avoid all these problems. Analysis include: the most common quality problems in shape packaging high pin pin spacing and solder the contact position of pin mapping, function and other related parameters