Turn-Key Electronics pcb printed circuit boards manufacturer Services 

Opening material

by:Rigao      2020-05-10
Objective: according to the requirements of engineering data MI, cut large sheets that meet the requirements into small pieces to produce plates. small pieces of sheet metal that meet customer requirements. process: large sheet metal → cutting board according to MI requirements → curium board → grinding edge of beer fillet → cutting board and drilling. Purpose: according to the engineering data, on the sheet metal that meets the required size, drill the desired aperture at the corresponding position. process: stacking plate pins → upper plate → drilling → lower plate → inspection and repair, copper deposition. Purpose: copper deposition is to deposit a thin layer of copper on the insulation hole wall by chemical method. process: rough grinding → hanging plate → Copper sinking automatic line → lower plate → immersion % dilute H2SO4 → thickened copper, graphic transfer purpose: Graphic transfer is to transfer images on the production film to the plate. Process :(Blue oil process) : Grinding plate → printing the first side → Drying → printing the second side → Drying → exposure → punching → inspection; (Dry film process) : Hemp board → compression film → standing → alignment → exposure → standing → punching → inspection, graphic plating, purpose: graphic electroplating refers to electroplating a layer of copper layer with the required thickness and gold, nickel or tin layer with the required thickness on the exposed copper sheet or hole wall of the line pattern. Process: upper plate → degreasing → washing twice → micro etching → washing → pickling → copper plating → washing → pickling → tin plating → washing → lower plate, film removal purpose: the anti-electroplating coating layer is retreated with NaOH solution to expose the non-line copper layer. Process: water film: insert rack → alkali dipping → Flushing → scrubbing → passing through the machine; Dry Film: plate release → machine etching purpose: etching is to corrode the copper layer on non-line parts by chemical reaction method. Green oil purpose: green oil transfers the pattern of green oil film to the board to protect the line and prevent tin on the line when welding parts. Process: grinding plate → printing photosensitive green oil → curium plate → exposure → Shadow punching; Grinding plate → printing the first side → baking plate → printing the second side → baking plate character, purpose: character is a mark provided for easy identification. Process: After the green oil is finished, → cooling and standing, → adjusting the net, → printing the characters, → Post-plating, gold-plated finger purpose: plating a layer of nickel-gold layer with the required thickness on the plug finger, make it more hard wear resistance. Process: upper plate → degreasing → washing twice → micro etching → washing twice → pickling → copper plating → washing → nickel plating → washing → Gold plating tin plate (A parallel process) Objective: tin spraying is to spray a layer of lead tin on the exposed copper surface not covered with solder resist oil to protect the copper surface from corrosion and oxidation so as to ensure good welding performance. process: Micro-etching → air drying → preheating → Rosin coating → solder coating → hot air leveling → air cooling → washing and air drying, molding purpose: through the mold stamping or numerical control Gong machine gong out of the shape required by the customer molding method organic Gong, Beer Board, hand gong, hand cut, description: data Gong machine Board and Beer Board higher accuracy, second, the hand cutting board can only make some simple shapes. test purpose: through electronic 00% test, detect defects that affect functionality, such as open circuit and short circuit, which are not easy to find visually. process: upper die → plate release → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap, final inspection, purpose: through 00% visual inspection of plate appearance defects, and minor defects are repaired to avoid problems and defective plate outflow. specific work flow: incoming materials → check data → visual inspection → qualified → FQA spot check → qualified → packaging → unqualified → treatment → check OK
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