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PCBA as electronic product to develop in the direction of miniaturization, high density assembly, SMT SMT technology today has become the electronic group

by:Rigao      2020-05-03
PCBA assembly method and its technological process mainly depends on the type of assembly components and assembly equipment conditions. In general can be divided into single SMT process, conventional process, double SMT process and double mixed four types. 1. Refers to the SMT process single pasted on the components for all SMT components, and components in the assembly of one side of the PCB. Single SMT process main processes: incoming material and printing the solder paste ( Patch glue or point) To patch to reflow soldering, cleaning, testing and repair. 2. Conventional process single conventional means components has both SMT components and instrumentation components, and components in the assembly of one side of the PCB. Main process: single conventional process incoming material and printing the solder paste ( Patch glue or point) To SMT, reflow soldering to cleaning -> plugins to wave soldering, cleaning, testing and repair. 3. Double refers to SMT process double pasted on the components for all SMT components, and components distribution on both sides of the PCB assembly. Double SMT process main process: from incoming material to A surface of PCB printing solder paste to patch, A reflow soldering - flap - PCB's B surface screen printing the solder paste - patch - B side reflow soldering to cleaning, testing and repair. 4. Double mixed loading process double mixed loading refers to the components has both SMT components and instrumentation components, and components distribution on both sides of the PCB assembly. Double main processes: conventional process incoming material to A surface screen printing solder paste, SMD - reflow soldering -> plugins - pin bending to flap, pastry patch glue to patch, drying (B Curing) To turn over to wave soldering, cleaning, testing and repair.
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