Turn-Key Electronics Manufacturing Services for PCB Assembly

HDI PCB

   

To meet the various needs of customers all over the world, Rigao Electronics not only provides common multilayer pcb fabrication and PCB assembly, but also High Density Interconnect (HDI) PCB turn-key electronics manufacturing services. The most manufacturing techniques for HDI PCB boards include blind & buried via, micro-via, epoxy resin or copper filled via, Controlled Impedance, fine lines in BGA pads, via in pad,  prototype circuit board fabrication,etc. The HDI boards we manufactured refer to many fields like IoT, telecom electronic, smart control, industrial control and digital devices. 

HDI PCB Capability
CategoryItemEnglishMetric
LaminatesMax. Number of Layers40 L40 L
Thickness of Thinnest 8 Layers HDI0.023"0.6 mm
The Thinnest Core3 mil (no copper)0.075 mm (no copper)
Finished Board Thickness Tolerance± 10%± 10%
TraceMin. Inner Layer Line Width2 mil0.05 mm
Min. Inner Layer Line Spacing2 mil0.05 mm
Min. Outer Layer Line Width2 mil0.05 mm
Min. Outer Layer Line Spacing2 mil0.05 mm
Key Trace and Tolerance3 mil±0.6mil0.075 mm±15um
HolesHole Position Tolerance± 3 mil± 0.075 mm
Hole Size Tolerance(PTH)± 3 mil± 0.075 mm
Hole Size Tolerance(NPTH)± 2 mil± 0.05 mm
Key HDI ProcessHDI Layer3+N+33+N+3
Controlled Impedance Tolerance± 3%± 3%
Min. Solder Mask Bridge2.5 mil0.065 mm
Min. Blind Hole Size4 mil0.1 mm
PTH & Buried Hole6 mil0.15 mm
Min. Pad with Via7 mil0.175 mm
Min. BGA Pitch13.7 mil0.35 mm
Min. BGA Pad8 mil0.2 mm
DrillMin. Mechanical Drill Hole Size6 mil0.15 mm
Min. Laser Drill Hole Size3 mil0.075 mm
Aspect Ratio12:112:1
Gold FingerAngle of Beveling 15-45°15-45°
Angle of Beveling Tolerance± 5°± 5°
Depth of Beveling≥ 4 mil≥ 0.1
Depth of BevelingTolerance± 3 mil± 0.075 mm
Color of Solder Mask GreenMatte GreenLight Green
BlackMatte BlackRed
YellowWhiteBlue
Color of Silk ScreenWhiteBlackYellow
 GreenRedBlue
Surface FinishingHASLHASL Lead FreeOSP
Immersion Gold (ENIG)Gold FingerSolf Gold


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