Turn-Key Electronics Manufacturing Services for PCB Assembly

Rigid-Flex PCB

Rigao Electronics manufactured many rigid-flex Printed Circuit Boards for our clients to meet their design requirements, pcb design and fabrication of rigid flex circuit boards,saving the internal space of products, reducing the volume of finished products and improving the performance of products. This kind of rigid-flex PCB boards also can be manufactured with blind & buried via, epoxy resin or copper filled via, Controlled Impedance process as well.

Rigid-Flex PCB Capability
CategoryItemEnglishMetric
LaminatesMax. Number of Layers16 L (R+F)16 L  (R+F)
Min. Finished Board Thickness0.01"0.3 mm
Max. Finished Board Thickness0.062"1.6 mm
Finished Board Thickness Tolerance± 10%± 10%
Max. Panel Size19.68" * 19.68"500 * 500 mm
CopperMax. Inner Layer Copper Thickness2 oz0.07 mm
Max. Outer Layer Copper Thickness3 oz0.105 mm
TraceMin. Inner Layer Line Width2 mil0.05 mm
Min. Inner Layer Line Spacing2 mil0.05 mm
Min. Outer Layer Line Width2 mil0.05 mm
Min. Outer Layer Line Spacing2 mil0.05 mm
Min. BGA Pitch13.7 mil0.35 mm
Min. BGA Pad8 mil0.2 mm
HolesHole Position Tolerance± 3 mil± 0.075 mm
Hole Size Tolerance(PTH)± 3 mil± 0.075 mm
Hole Size Tolerance(NPTH)± 2 mil± 0.05 mm
Min. Plated Slot15.7 mil0.4 mm
Min. Non-Plated Slot15.7 mil0.4 mm
DrillMin. Mechanical Drill Hole Size6 mil0.15 mm
Min. Laser Drill Hole Size3 mil0.075 mm
Max. Mechanical Drill Hole Size256 mil6.5 mm
Aspect Ratio12:112:1
Gold FingerAngle of Beveling 15-45°15-45°
Angle of Beveling Tolerance± 3°± 3°
Depth of Beveling≥ 4 mil≥ 0.1
Depth of BevelingTolerance± 3 mil± 0.075 mm
ProfileV-Cut Position Tolerance± 3 mil± 0.075 mm
CNC Tolerance± 4 mil± 0.1 mm
Stamping Tolerance± 4 mil± 0.1 mm
Special ProcessControlled Impedance Tolerance± 3%± 3%
Min. Pad with Via7 mil0.175 mm
Blind and Buried Via3+N+33+N+3
Plugged ViaResin Filled or Conductive Filled
Color of Solder Mask GreenMatte GreenLight Green
BlackMatte BlackRed
YellowWhiteBlue
Color of Silk ScreenWhiteBlackYellow
 GreenRedBlue
Surface FinishingHASLHASL Lead FreeImmersion Silver
Immersion Gold (ENIG)Gold Finger (Hard Gold)Immersion Tin
PCB MaterialFR-4 (SHENGYI)High TG FR-4 (SHENGYI)PI (Panasonic)
PTFE(Rogers)PTFE(Arlon)PTFE(Tuc)


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